然而，本轮涨价与以往周期最大的不同在于一个关键变量——HBM（高带宽内存）的爆发式增长。AI芯片（如英伟达H200/B200）对HBM的需求是传统DRAM的数倍甚至数十倍。三大原厂将大量先进制程产能转向HBM，挤占了原本用于生产手机LPDDR（低功耗内存）的产能。这种“结构性短缺”成为本轮涨价的核心推手。
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Do you know you can wildcard parts of selectors?
iFi's new DAC is eight percent smaller than the previous GO Link and 29 percent lighter, approaching the size of Apple's USB-C to 3.5mm Headphone Jack dongle. The GO Link 2's built-in ESS Sabre DAC chipset is supposed to add "6dB of dynamic range between the loudest and quietest moments" and reduce distortion for clearer sound by up to 62 percent when compared to the original GO Link.